Name | Date modified | File size |
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|---|---|---|---|
0.1_2025 AEC Welcome Document.pdf Shared | Mar 28, 2025 | 322 KB | |
0.2_AEC 2025 Technical Program Agenda_Handout_Updated.pdf Shared | Apr 9, 2025 | 241 KB | |
1.1_A Novel Approach to Anomalous Charge Current (ACC) Mitigation in Tantalum Polymer Devices_Emerick_AVX.pdf Shared | Apr 2, 2025 | 2.7 MB | |
1.2_Tantalum Polymer Capacitor Trends & Challenges - Software Defined Vehicles (SDV)_MotaCaetano_Yageo.pdf Shared | Apr 2, 2025 | 1.9 MB | |
1.3_AEC-Q200 Revision to Reflect Reed Technology Considering New IEC Standards for Increased Usage in Automotive Applications_Reizner_Standex.pdf Shared | Apr 2, 2025 | 3.4 MB | |
3.1_Technical Cleanliness for Electronic Components_Kappius-Ohlhoff_Hella-Continental.pdf Shared | Apr 2, 2025 | 3 MB | |
3.2_Commodity Quality Checklist-Lessons Learned & Management_Piana_Marelli.pdf Shared | Apr 2, 2025 | 1.1 MB | |
4.1_Extended Mission Profiles-NXP’s Approach to the Industry’s Challenges_Rongen_NXP.pdf Shared | Apr 3, 2025 | 1.7 MB | |
5.1_An Eco-System for Improving Semiconductor Reliability_Bhardwaj_Synopsys.pdf Shared | Apr 2, 2025 | 1 MB | |
5.2_A Review of Reliability Aging Methodologies for Circuit Simulation_Xie_Cadence.pdf Shared | Apr 2, 2025 | 2.4 MB | |
6.1_AEC-Q004 Zero Defects Framework Case Study_Brucker_Renesas.pdf Shared | Apr 2, 2025 | 1 MB | |
6.2_Artificial intellidence & Machine Learning Based Disposition for Zero Defects Implementation_Chinthakindi_Micron_Update.pdf Shared | Apr 8, 2025 | 835 KB | |
7.1_Failures in BGA Solder Joints- Failures Modes-Mechanisms-& Root Causes_Lan_Harman.pdf Shared | Apr 2, 2025 | 3.8 MB | |
7.2_Enhancing Automotive Reliability with Polymer Reinforcements & Solder Alloy_Lifton_MacDermid Alpha_Update.pdf Shared | Apr 10, 2025 | 2.9 MB | |
7.3_Assessing Electronics with Advanced 3D X-ray Microscopy Techniques_Gomez_ZEISS.pdf Shared | Apr 3, 2025 | 10.5 MB | |
7.4_Enhancing Reliability in High-Voltage Electronic Assemblies for Automotive Applications_Parthasararthy_Zestron.pdf Shared | Apr 7, 2025 | 2.2 MB | |
W.1_AEC-Q200 Activity Status & Discussion_Lambaz_Littelfuse.pdf Shared | Apr 7, 2025 | 169 KB | |
W.2_Wide Band Gap Activity Status & Discussion_Regardi_Nexperia.pdf Shared | Apr 10, 2025 | 1.7 MB | |
W.3_AEC-Q101_Abelein_Infineon.pdf Shared | Apr 8, 2025 | 186 KB | |
W.4_AEC-Q102_Mitsuhashi_Nichia.pdf Shared | Apr 7, 2025 | 819 KB | |
W.5_AEC-Q006_Abelein_Infineon.pdf Shared | Apr 7, 2025 | 1.1 MB | |
W.6_AEC-Q104 Multi-Chip Module (MCM) Activity Status & Discussion_Sibrel_Harman.pdf Shared | Apr 2, 2025 | 487 KB | |
W.7_Extended Mission Profiles Discussion_Rongen_NXP.pdf Shared | Apr 6, 2025 | 545 KB | |
W.8_AEC-Q004 Zero Defects Framework Activity Status & Discussion_Rongen_NXP.pdf Shared | Apr 5, 2025 | 342 KB | |
W.9_AEC-Q100 Activity Status & Discussion_Abelein_Infineon.pdf Shared | Apr 4, 2025 | 200 KB | |
W.10_Universal CDC Templates_Buzinski_Microchip.pdf Shared | Apr 9, 2025 | 297 KB | |
W.11_AEC-Q105 Electronic Displays Activity Status & Discussion_Sibrel_Harman.pdf Shared | Apr 2, 2025 | 853 KB |