Name | Date modified | File size |
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|---|---|---|---|
0.1_2024 AEC Welcome Document.pdf Shared | Apr 22, 2024 | 351 KB | |
0.2_AEC 2024 Technical Program Agenda_Handout.pdf Shared | Apr 22, 2024 | 248 KB | |
1.1_AEC-Q200 Revision E Brings 105ºC Rated Supercapacitors_Davila_Yageo-Kemet_Update.pdf Shared | Apr 19, 2024 | 1.7 MB | |
1.2_Multi-Layer Varistors Dual Role_Emerick_KAVX.pdf Shared | Apr 9, 2024 | 2.4 MB | |
1.3_A Corrosion Quantitation Technique_Lee_iST.pdf Shared | Apr 8, 2024 | 2.6 MB | |
2.1_SiC vs Si Inline Process Control_Price_KLA.pdf Shared | Apr 9, 2024 | 3.3 MB | |
2.2_Plasma Dicing for SiC_Barnett_KLA.pdf Shared | Apr 9, 2024 | 2.2 MB | |
2.3_Qualification of Optoelectronic Multi-Chip Modules_Ritzer_amsOSRAM_Update.pdf Shared | Apr 16, 2024 | 3.6 MB | |
3.1a_Challenges within the EE Value Chain - Part I_Senftleben_BMW.pdf Shared | Apr 9, 2024 | 3 MB | |
3.1b_Challenges within the EE Value Chain - Part 2_Tayal_Micron_Update.pdf Shared | Apr 12, 2024 | 1.7 MB | |
3.2_Safe Launch Challenges_Grogan-Chen_Macronix.pdf Shared | Apr 11, 2024 | 1.4 MB | |
3.3_Quality Assurance Through Design_Martin_TI_Update.pdf Shared | Apr 16, 2024 | 871 KB | |
3.4_LANNR-An Alternative Statistical Method of Outlier Screening_Chen_ISSI_Update.pdf Shared | Apr 19, 2024 | 1.2 MB | |
4.1_From Auto-Grade to EV-Grade_Lewitschnig-Duty_Infineon-STMicro_Update.pdf Shared | Apr 19, 2024 | 977 KB | |
4.2&W.5_Extended Mission Profiles_Rongen_NXP.pdf Shared | Apr 9, 2024 | 1 MB | |
5.1_Significance of ISO7637 Pulse 2a_Kaschani-Hommel_Bosch.pdf Shared | Apr 8, 2024 | 840 KB | |
5.2_Improving the Wire Bond Pull Test and FA for Copper Wired Components_Tang_JIACO.pdf Shared | Apr 8, 2024 | 2.3 MB | |
5.3_Harmonization-Justification for Common CDM Stress Procedure_Wakai_Toshiba.pdf Shared | Apr 10, 2024 | 3.5 MB | |
6.1_BLR Statistical Analysis_Albiston_Micron.pdf Shared | Apr 9, 2024 | 308 KB | |
6.2_Enabling Complex PCB Designs_Brennan_Indium.pdf Shared | Apr 9, 2024 | 1.6 MB | |
7.1_Cu Alloy Wire Selection_Fundan_STM_Update.pdf Shared | Apr 19, 2024 | 2 MB | |
7.2_Fingerprint Based Sensor WLP_Taraci_ZEISS.pdf Shared | Apr 8, 2024 | 1.6 MB | |
7.3_Failure Analysis-A Decisive Factor of the Semiconductor Reliability Flow_Marcovati_STMicro_Update.pdf Shared | Apr 22, 2024 | 3.1 MB | |
W.1_AEC-Q200 Passives Review_Cooper_Yageo.pdf Shared | Apr 19, 2024 | 811 KB | |
W.2_AEC-Q101 Discretes Review_Pinkernelle_Nexperia.pdf Shared | Apr 12, 2024 | 202 KB | |
W.3_AEC-Q102_LED-Optoelectronic Review_Berger_Hella_Update.pdf Shared | Apr 16, 2024 | 911 KB | |
W.4_Wide Band Gap_Gajewski_Wolfspeed_Update.pdf Shared | Apr 19, 2024 | 2 MB | |
W.6_AEC-Q004 Zero Defects Framework_Rongen_NXP.pdf Shared | Apr 9, 2024 | 430 KB | |
W.7_AEC-Q007 BLR_Roucou_NXP.pdf Shared | Apr 9, 2024 | 1.2 MB | |
W.8_AEC-Q006_Cu Wire Review_Abelein_Infineon.pdf Shared | Apr 21, 2024 | 358 KB | |
W.9_AEC-Q100 ICs Review_Abelein_Infineon.pdf Shared | Apr 21, 2024 | 3 MB | |
W.10_AEC-Q104_Multi-Chip Modules Review_Sibrel_Harman.pdf Shared | Apr 11, 2024 | 442 KB | |
W.11_AEC-Q105 Electronic Displays Review_Sibrel_Harman.pdf Shared | Apr 11, 2024 | 818 KB |