0.1_2024 AEC Welcome Document.pdf

0.2_AEC 2024 Technical Program Agenda_Handout.pdf

1.1_AEC-Q200 Revision E Brings 105ºC Rated Supercapacitors_Davila_Yageo-Kemet_Update.pdf

1.2_Multi-Layer Varistors Dual Role_Emerick_KAVX.pdf

1.3_A Corrosion Quantitation Technique_Lee_iST.pdf

2.1_SiC vs Si Inline Process Control_Price_KLA.pdf

2.2_Plasma Dicing for SiC_Barnett_KLA.pdf

2.3_Qualification of Optoelectronic Multi-Chip Modules_Ritzer_amsOSRAM_Update.pdf

3.1a_Challenges within the EE Value Chain - Part I_Senftleben_BMW.pdf

3.1b_Challenges within the EE Value Chain - Part 2_Tayal_Micron_Update.pdf

3.2_Safe Launch Challenges_Grogan-Chen_Macronix.pdf

3.3_Quality Assurance Through Design_Martin_TI_Update.pdf

3.4_LANNR-An Alternative Statistical Method of Outlier Screening_Chen_ISSI_Update.pdf

4.1_From Auto-Grade to EV-Grade_Lewitschnig-Duty_Infineon-STMicro_Update.pdf

4.2&W.5_Extended Mission Profiles_Rongen_NXP.pdf

5.1_Significance of ISO7637 Pulse 2a_Kaschani-Hommel_Bosch.pdf

5.2_Improving the Wire Bond Pull Test and FA for Copper Wired Components_Tang_JIACO.pdf

5.3_Harmonization-Justification for Common CDM Stress Procedure_Wakai_Toshiba.pdf

6.1_BLR Statistical Analysis_Albiston_Micron.pdf

6.2_Enabling Complex PCB Designs_Brennan_Indium.pdf

7.1_Cu Alloy Wire Selection_Fundan_STM_Update.pdf

7.2_Fingerprint Based Sensor WLP_Taraci_ZEISS.pdf

7.3_Failure Analysis-A Decisive Factor of the Semiconductor Reliability Flow_Marcovati_STMicro_Update.pdf

W.1_AEC-Q200 Passives Review_Cooper_Yageo.pdf

W.2_AEC-Q101 Discretes Review_Pinkernelle_Nexperia.pdf

W.3_AEC-Q102_LED-Optoelectronic Review_Berger_Hella_Update.pdf

W.4_Wide Band Gap_Gajewski_Wolfspeed_Update.pdf

W.6_AEC-Q004 Zero Defects Framework_Rongen_NXP.pdf

W.7_AEC-Q007 BLR_Roucou_NXP.pdf

W.8_AEC-Q006_Cu Wire Review_Abelein_Infineon.pdf

W.9_AEC-Q100 ICs Review_Abelein_Infineon.pdf

W.10_AEC-Q104_Multi-Chip Modules Review_Sibrel_Harman.pdf

W.11_AEC-Q105 Electronic Displays Review_Sibrel_Harman.pdf