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0.2_Automotive Electronics Council Chair Report 2019_Update - Tue Oct 15 V2.pdf
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1.1_Ag Plated Surfaces Status Affecting Thermomechanical Performance of Sintering Solder Joint_GiCo_MaSa_ST_V3.pdf
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1.2_Technology Platform Qualification for Power Semiconductor Devices_FrKi_Valeo_V3.pdf
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1.3_Thermal Waves Propagation Study on SiC_MaSa_ST_V3.pdf
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2.1_Implementation of I-PAT High Speed Defect Screening_ThKr_KLA_V2.pdf
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2.2_ST approach to Zero Defects in Automotive applications_PaEp_ST.pdf
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2.3_Inline Part Average Testing to Reduce Escapes from both Gaps in Test and Latent Reliability Defects - Continuing Feasability Study Results at NXP_JoRo_NXP.pdf
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3.1_Fast Wafer Level Reliability (fWLR) Monitoring as a Tool to Verify Stable Reliability for an Automotive Wafer Process_AnMa_Infineon.pdf
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3.2_How to Use Mission Profiles_KeRh_Samsung V3.pdf
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3.3_Application Level Reliability Testing for Automotive_RoRo_NXP_V2.pdf
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4.1_Heterointegration of Silicon and GaN LED Technology for Automotive Headlamps_MaRi_Osram.pdf
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4.2_New Whiskers phenomena_JeCa_Valeo.pdf
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4.3_Polymer Capacitor (KO CAP®) with capabilities beyond AEC-Q200 – A solution for Ultra Extended Mission Profiles_CrCa_Kemet.pdf
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5.1_Determining Analog Test Coverage_DiHa_Infineon.pdf
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5.2_Review of fatigue life models for solder joint reliability prediction_SiSc_BMW.pdf
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5.3_Temperature Cycling with Bending to Reproduce Typical Product Loads_LaLa_Bosch.pdf
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6.1_Environmental Testing for MEMS Microphones_CrCo_Vesper_V2.pdf
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6.2_MEMS Pressure Sensors Qualification acc to Released AEC Q103 002_MiBl_Melexis.pdf
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6.3_Advanced Robustness Validation and Reliability Assessment for MEMS_MiHi_Hella.pdf
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W1_AEC-Q004_ReRo_NXP.pdf
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W2.1_AEC RW Q101 Rev E Update April 2019 _PeTu_ON Semi.pdf
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W2.2_Q200_ChMe_Murata.pdf
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W3.1_Q100_RevJ_UlAb_Infineon.pdf
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W3.2_CDCQ plus_LuKa_Hella.pdf
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W4.1_AEC-Q102_UwBe_Hella.pdf
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W4.2a_Q104 MCM Qualification Update_StSi_Harman_V2.pdf
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W4.2b_AECQ105_Task Group Update_StSi_Harman_V2.pdf